Flip Chip Bonder & Hybrid Placer

i-CubeII

i-CubeII

Hybrid placer (Advanced flipchip & die bonder) YHP-2

i-CubeIID

i-CubeII

Direct wafer supply spec. hybrid placer YHP-2D

YSB55w

YSB55wP

High-Speed & High-Accuracy Flip Chip Bonder

YSH20

YSH20

High-speed, high-precision flipchip hybrid placer