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i-CubeII Surface Mount Technology | Flip Chip Bonder
Hybrid
Placer
Dipping,
Stamping
Mix-Mount
SMD & Semi
Dispensing
Features
Capable of mixed Mounting of SMD components and semi-conductor components
Capable of handling multiple types of components
Usable for dipping ・ stamping by the dipping unit
Applicable for a wide area up to L300mmxW200m
Specifications
| Model | i-CubeⅡ(YHP-2) | |
|---|---|---|
| PCB dimensions | L300xW200mm(max) to L30xW30mm(min) | |
| Mounting accuracy When using Yamaha's standard components |
F type | Absolute accuracy(µ+3σ):+/-20µm Repeatability(3σ):+/-12.5µm |
| 4M type | Absolute accuracy(µ+3σ):+/-30µm Repeatablility(3σ):+/-20µm |
|
| Mounting/dispensing cycle time (Under optimum conditions) *Process time not included |
4M type | 0.5sec/CHIP (When continuous pickup at work) |
| FF type | 0.8sec/CHIP(Tape reel and tray supply case) 1.3 sec/CHIP(Wafer supply case) |
|
| FD type | As the measures vary depending on the operation,please consult separately. | |
| External dimensions | L1,350xW1,408xH1,850mm | |
* About details, please consult us separately.
Specifications and appearance are subject to change without prior notice.