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i-CubeIID Surface Mount Technology | Flip Chip Bonder
Hybrid
Mounter
6,000
UPH
Mix-Mount
SMD & Semi
Direct
Pick-Up
Features
By direct pick-up, excellent wafer-barechip mounting tact 6,000CPH and quality as assured
Capable of mixed mounting of SMD components and semi-conductor components
Optimum for the assembly process of MEMS, Power Modules, CCD/CMOS Sensor, LED, components
Specifications
| Model | i-CubeⅡD(Model code:KJG-000) | |
|---|---|---|
| PCB dimensions | L300xW150mm(Max) to L30xW30(min) | |
| Mounting accuracy When using Yamaha's standard components |
4M type | Repeatability(3σ):+/-20µm |
| Mounting cycle time Under optimum conditions |
4M type | 0.6sec/CHIP |
| External dimensions | L1,350xW1,756xH1,850mm | |
* About details, please consult us separately.
Specifications and appearance are subject to change without prior notice.