i-CubeIID

i-CubeIID
Hybrid
Mounter
6,000
UPH
Mix-Mount
SMD & Semi
Direct
Pick-Up


Features

By direct pick-up, excellent wafer-barechip mounting tact 6,000CPH and quality as assured

Capable of mixed mounting of SMD components and semi-conductor components

Optimum for the assembly process of MEMS, Power Modules, CCD/CMOS Sensor, LED, components


Specifications

Model i-CubeⅡD(Model code:KJG-000)
PCB dimensions L300xW150mm(Max) to L30xW30(min)
Mounting accuracy
When using Yamaha's standard components
4M type Repeatability(3σ):+/-20µm
Mounting cycle time
Under optimum conditions
4M type 0.6sec/CHIP
External dimensions L1,350xW1,756xH1,850mm

* About details, please consult us separately.

Specifications and appearance are subject to change without prior notice.

Yamaha i-CubeIID Flip Chip Bonder

Flip Chip Bonder