YSi-SP

YSi-SP
3D Solder &
Bond coating Inspection
Print
Offset Feedback
SPI Linked
to all mounting
machines
SPC
with diverse
statistical processing


Features

Simplified single head solution for reduced maintenance & reliability

3D 3-step algorithm and 2D contour extraction yields high precision at high speed

A thorough and extensive machine-to-machine (M2M) solution

Statistical Process Control (SPC) for diverse statistical processing

Optional features to enable handling various products


Specifications

Model YSi-SP
Applicable PCB L 510 x W 460 mm to L 50 x W 50 mm (single lane spec)
*No dual lane specification available.
Horizontal resolution (FOV size) 1)25 µm / 12.5 µm (approx. 50 x 50 mm)
2)20 µm / 10 µm (approx. 40 x 40 mm)
3)15 µm / 7.5 µm (approx. 30 x 30 mm)
*All are standard selection type.
Power supply 3-phase AC 200/208/220/240/380/400/416 V +/- 10%
Height resolution 1 µm
Inspection items Solder paste printing quality (volume, height, area and misalignment)
Power supply Single-phase AC 200 V–230 V ±10 %
Air supply source Airless specification
External dimension L 904 x W 1,080 x H 1,478 mm
Weight Approx. 550 kg

Yamaha YSi-SP Inspection Solution

SPI Machine