i-Cube10 Hybrid Placer i-Cube10 Overview

Mixed mounting of semiconductor and SMD

It is capable of various types of the production process, and YRH10 realizes SMT for semiconductor, SMD in one unit. Post-mounting inspection is provided as a standard feature.

Supply patterns

Pin transfer of adhesives (option)

Example of module component packaging process


Dipping station

Dipping pins

Dipping pins

Pallet types

Wafer pallets (standard)

6inch wafer pallet

6inch wafer pallet

8inch wafer pallet

8inch wafer pallet

Waffle tray pallets (custom order)


2inch waffle tray pallet Maximum settable number of pallets : 9


4inch waffle tray pallet Maximum settable number of pallets : 4

High-speed and high-accuracy mounting

Placer with 10-nozzles on the mounting head realizes high productivity while maintaining high-level mounting accuracy.

Inline head with a scan camera

High-speed flexible head covers from super-tiny components to middle size odd-shaped components. The adoption of a scan camera makes the operation distance from pickup to mounting shortest, which achieves high productivity.

Scan camera


Multiple Accuracy Compensation System (MACS)

New compensation function + high-accuracy positioning Yamaha proprietary Compensation System realizes high mounting accuracy of ±15μm (μ+3σ).

high-accuracy positioning
high-accuracy positioning

Available for intelligent feeder and various options

Available for intelligent feeder which improves the pickup accuracy for tape reel component. Combining with the Multiple Accuracy Compensation System MACS realizes high-accuracy component pickup and mounting.

ZS feeder


ZS feeder

Available for electric intelligent feeder which are also used for machine. Compact and light-weight feeders improve the workability and reduces burdens to operators.

Auto Loading Feeder


An Auto Loading Feeder for which two reels can be set in advance is also supported. This type eliminates the need for splicing and can vary the supply timing. This significantly reduces the decrease in the operating rate due to running out of components.

Various options


Nozzle station Make automatic replacements of special and spare nozzles.

Available for nozzles stations, blow stations, and other options for various applications.

Applicable for various production processes


Customizable for various production layouts based on product types. The highly productive flexible placer contributes to realizing highly efficient production processes.

Standard layout

■Rear:YWF wafer supply unit
■Front:Feeder (24 in-line plate) x2

For power modules (custom-order layout)

■Rear:YWF wafer supply unit
■Front:Solder cutter x2

For MEMS sensors

■Rear:YWF wafer supply unit
■Front:Feeder (24 in-line plate) + dipping station


  • Nozzle station
  • Blow station
  • PCB height measurement laser sensor and nozzle height compensation touch sensor
  • Multi camera (A complete set for the front is available as an option,field of view : 20mm)
  • Ionizer (tape feeder side and wafer side)
  • IT option available
  • YSUP supported
  • UPS
  • Dipping station

i-Cube10 | Surface Mount Technology | Flip Chip Bonder

Flip Chip Bonder